Mark Gerber
Senior Director, Engineering, Marketing & Technical Promotion ASE
Mark is Senior Director Engineering, Marketing & Technical Promotion at ASE, and provides technical support for customer activities focused around Flip Chip, Interconnect, and SiP Packaging Technologies, within 5G, AI, Mobile, Automotive and IoT.
With over 25 years of semiconductor packaging experience, Mark previously worked at Texas Instruments, Motorola SPS, and Dallas Semiconductor in various areas of manufacturing, assembly and testing of electronics components and systems, with an emphasis on new product introductions (NPIs) and the development of new technologies and processes. Mark holds a Bachelor’s degree in Mechanical Engineering from Texas A&M University, has written 25+ papers and holds over 32 semiconductor packaging patents.