Hosted Session: Advanced Packaging: Transforming Electronics

Friday, February 19 | 10:30 am - 11:00 am

Online, Central European Time (CET)

Hosted by

Please join a conversation between ASE technologists Rich Rice, John Hunt, and Mark Gerber, where they will explore cutting-edge heterogeneous integration technologies that address functional areas from silicon integration, power integration, optical integration to system integration, all of which form the backbone of many electronic components, subsystems, and electronics products today.

As a leading semiconductor packaging, test, and system service provider, ASE’s advanced packaging technologies enable an overall system module integration experience, and provide a crucial bridge from the fab all the way to the system while meeting demand across dynamic 5G, AI, HPC, Automotive and Mobile markets.

We look forward to you joining us.

Featured Speakers

Rich Rice

Senior Vice President of Marketing and Technology Promotion ASE

Rich Rice currently serves as Senior Vice President of Marketing and Technology Promotion at ASE, with responsibilities within the North America region. Since joining ASE in 2003, Rich has also held positions overseeing Business Development, West Region and North American sales and applications engineering support.

Rich has gained over thirty-six years of experience within the semiconductor industry, having previously performed various engineering and business development roles both at Amkor Technology and National Semiconductor Corporation. He actively serves in advisory roles for the iMAPS Executive Council as President of the society, iMAPS Global Business Council, the ISS organizing committee for SEMI, the board of directors of a privately held technology company, as well as co-chair of the automotive TWG for the HIR (Heterogeneous Integration Roadmap) effort lead by Dr. Bill Chen and Dr. Bill Bottoms. Rich holds a BS degree in Agricultural Engineering from the University of Illinois.

John Hunt

Senior Director, Engineering, Marketing & Technical Promotion ASE

John Hunt is Senior Director Engineering, Marketing & Technical Promotion at ASE, where he provides technical support for the Introduction, Engineering, Marketing, and Business Development activities for Advanced Wafer Level and Fan Out Packaging Technologies.

John has more than 45 years of experience in various areas of manufacturing, assembly and testing of electronic components and systems, with emphasis on the development of new technologies and processes. He has a B.S. from Rutgers and an M.S. from the University of Central Florida.

Mark Gerber

Senior Director, Engineering, Marketing & Technical Promotion ASE

Mark is Senior Director Engineering, Marketing & Technical Promotion at ASE, and provides technical support for customer activities focused around Flip Chip, Interconnect, and SiP Packaging Technologies, within 5G, AI, Mobile, Automotive and IoT.

With over 25 years of semiconductor packaging experience, Mark previously worked at Texas Instruments, Motorola SPS, and Dallas Semiconductor in various areas of manufacturing, assembly and testing of electronics components and systems, with an emphasis on new product introductions (NPIs) and the development of new technologies and processes. Mark holds a Bachelor’s degree in Mechanical Engineering from Texas A&M University, has written 25+ papers and holds over 32 semiconductor packaging patents.