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Hosted Session: Advanced Packaging: Transforming Electronics

Tuesday, February 16 | 9:00 am - 9:30 am
Online, Central European Time (CET)

Hosted by

ASE, Inc


Please join a conversation between ASE technologists Rich Rice, John Hunt, and Mark Gerber, where they will explore cutting-edge heterogeneous integration technologies that address functional areas from silicon integration, power integration, optical integration to system integration, all of which form the backbone of many electronic components, subsystems, and electronics products today.

As a leading semiconductor packaging, test, and system service provider, ASE’s advanced packaging technologies enable an overall system module integration experience, and provide a crucial bridge from the fab all the way to the system while meeting demand across dynamic 5G, AI, HPC, Automotive and Mobile markets.

We look forward to you joining us.

Featured Speakers

Rich Rice

Rich Rice

Senior Vice President of Marketing and Technology Promotion ASE
John Hunt

John Hunt

Senior Director, Engineering, Marketing & Technical Promotion ASE
Mark Gerber

Mark Gerber

Senior Director, Engineering, Marketing & Technical Promotion ASE